11th International Conference on Electromagnetic Interference & Compatibility - (INCEMIC 2010) and Workshop
 
                                           

 

Workshop Programme Schedule updated. Please see Important Dates link for change of dates. No extra tax for delegate fees.

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INCEMIC 2010  

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SEMCE(I)

Workshop Date and Venue

        Workshop : 23-24 November 2010

                    NIMHANS Convention Centre

                    NIMHANS, Hosur Road

                    Bangalore - 560 029, India.

 

Workshop Programme Schedule (New Updated 18 Nov 2010)

 

Conference Programme Schedule  (New Updated 18 Nov 2010)

   

Workshop & Tutorials

A two-day Workshop cum Tutorials on the latest trends in the field of EMI & EMC will be conducted by expert faculty. 

The aims and objectives of the workshop are to give hands-on practical and design oriented technical know-how to the participants based upon case studies. It will also be a platform where the participants will have an in-depth exposure to the state-of-the art cutting edge technologies designed and developed over the years in EMC Technology.

The workshop is designed to give a new dimension so as to implement EMC Techniques in Military & Civilian Systems from the design, development up to the production stages.

SPEAKER CHANGES: Occasionally it is necessary for reasons beyond our control to alter the content and timing of the programme or identity of the speakers.

Please visit this link Workshop Brochure or for more details just scroll down below.

       

Delegate fee for attending the workshop*

  • General :                                                Rs. 5,000/- (US $135/-)
  • SEMCE(I) / IEEE / IETE Members :  Rs. 4,500/- (US $125/-)
  • Students (Full Time Only):                   Rs. 1,500/-

      Late fee for registration after deadline: Original fee + (Rs. 500/- or $12/- respectively)

      No extra tax for delegate fees

       

Registration Deadline:

        November 10, 2010 (Sunday)

Download Registration Form 

         doc format      pdf format      jpg format            

 

         

Topics

          Pre symposium tutorials by eminent international experts on the following topics are being organised.

          Developments & Issues in EMC Test Standards, Design Concept to Achieve EMC on Printed Circuit Boards

          The Evolution of CISPR Standards         

          EMC in High Speed Design: Not a Black Magic

Fundamental Principle of EM Wave Absorber for EMC Anechoic Chamber & its Application

 

1. Developments & Issues in EMC Test Standards, PCB Design Issues (Full Day)

    by T D N Williams, Elmac Services, UK

     The subject cover will be as follows:       

     a.  Immunity testing

          

          i.   Changes in the second editions of IEC 61000-4-2 (ESD), -4 (EFT/B), -5 (surge) and -6 (conducted RF)

               - particularly cable loading & Large equipment

           ii.  edition 3 of IEC 61000-4-3 (radiated RF) 

               -  particularly testing above 1 GHz & new checks on amplifier saturation

               -  amplifier saturation also in MIL STD 461F RS103

          iii. conducted susceptibility developments in MIL STD 461F

          iv. the application of measurement uncertainty to immunity 

          v.  the CENELEC interpretation sheets

 

     b.  Emissions testing

 

          i.   CISPR 22 tests above 1 GHz & SVSWR calibration, 

          ii.  developments in the telecom port conducted emission tests

          iii.  the consequences of new developments in CISPR 16-1-X

          iv. CISPR 32 and 35 developments

          v.  time domain FFT measurements

          vi.  RE101 and 102 changes in MIL STD 461F, use of the rod antenna.

 

 

2. The Evolution of CISPR Standards: A Review of Trends & Expected Changes to CISPR Test & Measurements Standards on EMC

    by Martin Wiles, ETS-Lindgren, UK

    The subject cover will be as follows:       

    The Generic, Basic & Product standards developed by the IEC & its special committee CISPR form the corner stone of EMC standardisation. Each year     the annual meeting takes place in October somewhere in the world & this year it was in Seattle, Washington, USA. The meeting brings together the world experts in EMC in one place over a two week period to discuss active projects & progress on all standards under the various CISPR & IEC SC/77 committees. This lecture will review the key projects & publications discussed at the meeting in order to give a brief, but up to date overview of the current status of IEC/CISPR EMC standardisation.

   

3.  EMC in High Speed Design: Not a Black Magic  (~ 4 hrs)

     by Dr Mosin Mondal, Cadence Design Systems(I) Pvt. Ltd., India

 

 

4. Fundamental Principle of EM Wave Absorber for EMC Anechoic Chamber & its Application

    by Dr Hiroshi Kurihara & Masakazu Ito, TDK RF Solutions, USA

     The subject cover will be as follows:  .

     a.  Summary of EMC Anechoic Chamber

          

     b.  Fundamental Principle of Hybrid EM Wave Absorber

 

     c.  Design Technique for EMC Anechoic Chamber

 

     d.  CALTS for Antenna Evaluation

 

Brief Introduction to the faculties
TDN Williams, Elmac Services, UK

Tim Williams gained a BSc in Electronic Engineering from Southampton University in 1976. He has worked in electronic product design in various industry sectors including process instrumentation and audio visual control. He was Design Group Leader at Rosemount Ltd. before leaving in 1990 to start Elmac Services. Elmac Services provides consultancy & training on all aspects of EMC, including design, testing and the application of standards, to companies manufacturing electronic products and concerned about the implications of EMC requirements.

He is the author of “The Circuit Designer’s Companion” (2nd edition, Elsevier 2004) and “EMC for Product Designers” (now in its fourth edition, Elsevier 2006), and has presented numerous conference papers and seminars. He is also author of “EMC for Systems & Installations” with Keith Armstrong. He is an EMC technical assessor for UKAS and SWEDAC.

 
Martin Wiles, ETS-Lindgren, UK

Martin Wiles is a Senior RF Engineer, ETS-Lindgren, in Stevenage, England. He has been with ETS-Lindgren since 1992 with the responsibility for RF Engineering for EMC & antenna measurement chambers in Europe. Before joining ETS-Lindgren, he worked for ABB Switzerland in support of the original work on the GTEM cell. He holds a B.Sc. in Physics from the University of Bath (UK) & an M.Sc. in Microwave Electronics from the University of Paris VI (France). He represents the UK on CISPR SC/A responsible for the CISPR 16 publication. He can be reached by e-mail at martin.wiles@ets-lindgren.com.

 
Dr Mosin Mondal, Cadence Design Systems(I) Pvt. Ltd., India

Dr. Mosin Mondal, Member of Consulting Staff, Cadence Design Systems(I) Pvt. Ltd., India received his PhD in Electrical Engineering from University of Washington, Seattle, USA in 2009 & MS in Electrical & Computer Engineering from Rice University, Hoston, USA. His areas of interest includes on-chip & off-chip power & signal integrity, circuit-electromagnetic co-simulation, computational geometry, DRC checking, interconnect modeling, CAD for VLSI systems. He is working in Cadence Systems since January 2010 in the development group of Virtuoso Space Based Router & Design Rule Checker. He was with IBM Corporation, RTP, USA as a Technical Co-op June-Dec 2007. He has received various awards & honors, namely IEEE EMC Society President’s Memorial Award 2008-2009, Best Paper at the IEEE EPEP Conference 2007, Research Assistantship, Dept. of EE, University of Washington 2007-2009, Rice University Graduate Fellowship, Research Assistantship 2004-2006, Excellence in Execution Award, Cadence Design Systems 2004, etc. He has published about 21 papers. He has contributed a chapter "Power Integrity Analysis & EMI/EMC" in the book "Power Integrity Analysis & Management for Integrated Circuits", published by Prentice-Hall, May, 2010. He is a Student Member of IEEE 2004-2009.

 
Dr. Hirishi Kurihara, TDK RF Solutions, USA

Dr. Hiroshi Kurihara, Senior Technical Manager, TDK, received his B.E. in engineering from Tokyo Denki University in March 1983 & Doctor degree in engineering from Aoyama Gakuin University in March 2006. He is responsible for the specification of the design & performance of Anechoic Chambers & provides the technical direction to the engineering and projects. He joined TDK Corporation in 1983 & he has been engaged in Research & Development of EM Wave Absorbers & Anechoic Chambers for 25 years in TDK & TDK-EPC. He has to his credit several patents in new absorber technology. He has designed &developed many kinds of new absorbers to suit various categories of Anechoic Chambers. He is a Senior Member of IEICE & Institute of Electrical Engineers of Japan (IEEJ).

 
Masakazu Ito, TDK RF Solutions, USA

Masakazu Ito, Technical Solutions Director, TDK RF Solutions, Austin, Texas, USA received the B.S. degree from Shibaura Institute of Technology, Japan in 1990 in Industrial Chemistry with a a specialisation in radio absorptive materials. From 1990 to 2006, he worked as an electromagnetic materials engineer within the EMC Engineering Division of TDK Corporation, Tokyo, Japan. His main areas of specialty are high performance anechoic chamber design, EMC metrology measurements, & specialised test systems for next generation wireless. He is a Senior Member of IEICE & Institute of Electrical Engineers of Japan (IEEJ).

   
   

You can also visit the link Workshop.

 
       
       
 
 
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